Websites targeting keyword rfic
12 websites are using keyword rfic in their content.
Total results: 12
Domains on this page: 12
Results:
�ؼ��й���-�й���רҵ����ҵ�ؼ���Ѷ��http://portalrankings.com/info/componentcn.com
控件中国网是一家优秀的软件、控件代理销售和技术服务网站，致力于为国内软件开发公司提供全面、合理的软件、控件产品解决方案、产品购买指南和产品售后技术服务。我们本着坚韧、严谨的态度经营我们的企业，以完整周到的服务诚挚地对待我们的每一个客户。
- Updated On (Date): 2016-Oct-20
- Expiration time: 2018-Aug-15
- Website Registered On (Date): 2006-Aug-15
4G Wireless LTE and WiMAX Semiconductor Solutions | GCT Semiconductorhttp://portalrankings.com/info/gctsemi.com
GCT Semiconductor is a leading fabless chipset semiconductor company that designs, develops and markets innovative LTE and WiMAX integrated circuit solutions for the 4G wireless communications industry.
- Google Analytics code: 30053720-1
- Updated On (Date): 2016-Aug-22
- Expiration time: 2025-Feb-02
- Website Registered On (Date): 2001-Feb-02
RFIC 2017 | Honolulu, Hawaii | 4-6 Junehttp://portalrankings.com/info/rfic-ieee.org
The 2017 IEEE Radio Frequency Integrated Circuits Symposium will be held in Honolulu, Hawaii, 4-6 June.
- Google Analytics code: 43067921-1
- Updated On (Date): 2012-Sep-22
- Expiration time: 2017-Jul-23
- Website Registered On (Date): 2012-Jul-23
Berex | RF technologies and products for the wireless industryhttp://portalrankings.com/info/berex.com
BeRex is focusing on and dedicated to RF technology and products for wireless industry.
- Google Analytics code: 2218722-2
- Updated On (Date): 2015-Sep-20
- Expiration time: 2020-Nov-19
- Website Registered On (Date): 1997-Nov-20
�й��Ƶ���Ʒ������-�Ƶ���Ʒרҵ��Ϣ����ƽ̨http://portalrankings.com/info/9dvip.com
中国酒店用品商情网（9dvip.com）是酒店用品专业信息服务平台，为您提供产品、求购、企业、品牌、招商、资讯、展会、采购、酒店用品城等行业信息，是酒店用品行业专属B2B门户网站，为酒店用品企业开拓电子商务提供整体解决方案。找酒店用品，上中国酒店用品商情网！服务热线：400-011-7177。
- Updated On (Date): 2016-Sep-18
- Expiration time: 2019-Oct-29
- Website Registered On (Date): 2014-Oct-29
Mirror Semiconductor M-QFN preplated NiPdAu Open Air Cavity QFN Protype IC packaging for MPW Multi-Project wafer MPW foundry shuttle service. Wafer foundries. Pre moulded. Chip Assembly, Chip packages , Open Cavity QFN... . . . . M-QFN8W.65-G5 , M-QFN12W.5-G6 , M-QFN12W.65-G6 , M-QFN12W.8-G6 , M-QFN16W.5-AE , M-QFN16W.5-G6 , M-QFN16W.65-G5 , M-QFN16W.8-G6 , M-QFN20W.4-G6 , M-QFN20W.5-G5 , M-QFN20W.65-G6 , M-QFN20W.8-G6 , M-QFN24W.5-G6 , M-QFN24W.65-G6 , M-QFN24W.8-G6 , M-QFN28W.4-G3 , M-QFN28W.4-G6 , M-QFN28W.5-G6 , M-QFN28W.65-G6 , M-QFN28W.8-G6 , M-QFN32W.5-AE , M-QFN32W.5-G6 , M-QFN32W.65-G6 , M-QFN32W.8-G6 , M-QFN36W.4-G6 , M-QFN36W.5-G6 , M-QFN40W.4-G5 , M-QFN40W.5-G6 , M-QFN40W.65-G6 , M-QFN44W.5-G6 , M-QFN44W.65-G6 , M-QFN48W.4-G5 , M-QFN48W.5-AE , M-QFN48W.5-G6 , M-QFN52W.5-G6 , M-QFN56W.4-G6 , M-QFN56W.5-G5 , M-QFN64W.4-G6 , M-QFN64W.5-G5 , M-QFN68W.4-G6 , M-QFN68W.5-G6 , M-QFN72W.4-G6 , M-QFN72W.5-G5 , M-QFN76W.4-G6 , M-QFN80W.5-G5 , M-QFN88W.4-G3 , M-QFN88W.4-G6 , M-QFN100W.4-G3 , M-QFN100W.4-G6 . . . . 460850 , 451260 , 451660 , 451670 , 461650 , 452050 , 452460 , 453260 , 453270 , 444050 , 454060 , 444850 , 454860 , 454870 , 455650 , 456450 , 457250 , 458050 , 461260 , 481260 , 481660 , 442060 , 462060 , 482060 , 462460 , 482460 , 442860 , 442830 , 452860 , 462860 , 482860 , 463260 , 483260 , 443660 , 453660 , 464060 , 454460 , 464460 , 455260 , 445660 , 446460 , 446860 , 456860 , 447260 , 447660 , 448860 , 448830 , 449960 , 449930 . . . . Footprints match OmPP and OCPP and Open-Pak OCP , DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B , Microelectronic semiconductor assembly, pkg parts, packaging, packages, . . . IC assembly, assemblies, assembly packaging and test Ball bonding, Wire bonding , microelectronics , wedge bonding. Die bonding , die bond process, die bonder machine. Chip scale package, RF IC design , RFIC design. MEMSic , MEMS Package Packaging , semiconductors , foundry services, foundries , wafers , Wafer dicing , chip carrier package, chip die ,http://portalrankings.com/info/mirrorsemi.com
Open Air Cavity QFN Package. Organic Open Cavity for MEMS, RF, Sensors and Semiconductors.
- Updated On (Date): 2017-Jan-24
- Expiration time: 2020-Apr-13
- Website Registered On (Date): 2006-Apr-13
تراشه فناور ماد | خانهhttp://portalrankings.com/info/tfmchip.com
Knowledge-based company, IC DESIGN HOUSE,SHARIF ADVANCED TECHNOLOGIES INCUBATOR
- Updated On (Date): 2017-Apr-08
- Expiration time: 2018-Apr-29
- Website Registered On (Date): 2015-Apr-29
最好最安全的空包网_全国代发空包快递_真实淘宝空包_极致空包网http://portalrankings.com/info/jizhikongbao.com
- Updated On (Date): 2017-May-02
- Expiration time: 2017-Nov-20
- Website Registered On (Date): 2014-Nov-20
IMS2015 | IEEE Microwave Week | International Microwave Symposium | IMS 2015http://portalrankings.com/info/ims2015.org
The IEEE International Microwave Symposium (IMS2015) will be held 17 - 22 May 2015 in Phoenix, Arizona as the centerpiece of Microwave Week 2015.
- Google Analytics code: 5565007-48
- Updated On (Date): 2014-Jan-07
- Expiration time: 2018-Jun-21
- Website Registered On (Date): 2000-Jun-21
IMS2017 | IEEE Microwave Week | International Microwave Symposium | IMS 2017http://portalrankings.com/info/ims2017.org
The IEEE International Microwave Symposium (IMS2017) will be held 4 - 9 June 2017 in Honolulu, Hawaii as a part of Microwave Week 2017
- Google Analytics code: 5565007-64
- Updated On (Date): 2017-Jun-23
- Expiration time: 2020-Jun-21
- Website Registered On (Date): 2000-Jun-21
������ �C �й��㽭��, �㽭��һ�Ż���վhttp://portalrankings.com/info/zjchina.cc
- Updated On (Date): 2017-Aug-30
- Expiration time: 2023-May-17
- Website Registered On (Date): 2014-May-17