Websites targeting keyword the 1212 project
15 websites are using keyword the 1212 project in their content.
Total results: 15
Domains on this page: 15
Different keywords:
Results:
IGNOU SOLVED ASSIGNMENTShttp://portalrankings.com/info/abhasolutions.in
India's No 1 IGNOU SOLVED ASSIGNMENT / PROJECT Provider .... Any Query Call Us @ 9852900088 / 9199852182
- Google Analytics code: 56810671-2
- Updated On (Date): 2016-Jul-16
- Expiration time: 2020-Jul-25
- Website Registered On (Date): 2014-Jul-25
The Sphere Handbook | Homehttp://portalrankings.com/info/spherehandbook.org
- Google Analytics code: 20463072-4
- Updated On (Date): 2017-Feb-06
- Expiration time: 2018-Feb-27
- Website Registered On (Date): 2012-Feb-27
Ashiq Uz Zohahttp://portalrankings.com/info/iayon.com
Software Developer, Entrepreneur and Technology enthusiast. Love to code, develop native Apps for Mobile Platform.
- Google Analytics code: 67789897-1
- Updated On (Date): 2016-Aug-21
- Expiration time: 2017-Aug-20
- Website Registered On (Date): 2015-Aug-20
Morteza Davari Personal Websitehttp://portalrankings.com/info/md6712.com
Morteza Davari Personal Website; Home
- Google Analytics code: 17183263-2
- Updated On (Date): 2017-Dec-27
- Expiration time: 2019-Jan-05
- Website Registered On (Date): 2010-Jan-05
Blood Donors Club, Bangladeshhttp://portalrankings.com/info/blooddonorsbd.com
A Community of Voluntary Blood Donors of Bangladesh. List of Bangladeshi blood donors profile and list of current blood request.
- ID for Google Adsense: ca-pub-7972797211894186
- Google Analytics code: 33222478-1
- Updated On (Date): 2017-Jan-26
- Expiration time: 2018-Jan-26
- Website Registered On (Date): 2012-Jan-26
CodersClan - Code Outsourcing That Actually Workshttp://portalrankings.com/info/codersclan.com
Get the most dedicated coding team that will follow your project from start to finish. Working with coders has never been easier - Start Now!
- Updated On (Date): 2016-Feb-24
- Expiration time: 2019-Mar-17
- Website Registered On (Date): 2014-Mar-17
Mirror Semiconductor M-QFN preplated NiPdAu Open Air Cavity QFN Protype IC packaging for MPW Multi-Project wafer MPW foundry shuttle service. Wafer foundries. Pre moulded. Chip Assembly, Chip packages , Open Cavity QFN... . . . . M-QFN8W.65-G5 , M-QFN12W.5-G6 , M-QFN12W.65-G6 , M-QFN12W.8-G6 , M-QFN16W.5-AE , M-QFN16W.5-G6 , M-QFN16W.65-G5 , M-QFN16W.8-G6 , M-QFN20W.4-G6 , M-QFN20W.5-G5 , M-QFN20W.65-G6 , M-QFN20W.8-G6 , M-QFN24W.5-G6 , M-QFN24W.65-G6 , M-QFN24W.8-G6 , M-QFN28W.4-G3 , M-QFN28W.4-G6 , M-QFN28W.5-G6 , M-QFN28W.65-G6 , M-QFN28W.8-G6 , M-QFN32W.5-AE , M-QFN32W.5-G6 , M-QFN32W.65-G6 , M-QFN32W.8-G6 , M-QFN36W.4-G6 , M-QFN36W.5-G6 , M-QFN40W.4-G5 , M-QFN40W.5-G6 , M-QFN40W.65-G6 , M-QFN44W.5-G6 , M-QFN44W.65-G6 , M-QFN48W.4-G5 , M-QFN48W.5-AE , M-QFN48W.5-G6 , M-QFN52W.5-G6 , M-QFN56W.4-G6 , M-QFN56W.5-G5 , M-QFN64W.4-G6 , M-QFN64W.5-G5 , M-QFN68W.4-G6 , M-QFN68W.5-G6 , M-QFN72W.4-G6 , M-QFN72W.5-G5 , M-QFN76W.4-G6 , M-QFN80W.5-G5 , M-QFN88W.4-G3 , M-QFN88W.4-G6 , M-QFN100W.4-G3 , M-QFN100W.4-G6 . . . . 460850 , 451260 , 451660 , 451670 , 461650 , 452050 , 452460 , 453260 , 453270 , 444050 , 454060 , 444850 , 454860 , 454870 , 455650 , 456450 , 457250 , 458050 , 461260 , 481260 , 481660 , 442060 , 462060 , 482060 , 462460 , 482460 , 442860 , 442830 , 452860 , 462860 , 482860 , 463260 , 483260 , 443660 , 453660 , 464060 , 454460 , 464460 , 455260 , 445660 , 446460 , 446860 , 456860 , 447260 , 447660 , 448860 , 448830 , 449960 , 449930 . . . . Footprints match OmPP and OCPP and Open-Pak OCP , DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B , Microelectronic semiconductor assembly, pkg parts, packaging, packages, . . . IC assembly, assemblies, assembly packaging and test Ball bonding, Wire bonding , microelectronics , wedge bonding. Die bonding , die bond process, die bonder machine. Chip scale package, RF IC design , RFIC design. MEMSic , MEMS Package Packaging , semiconductors , foundry services, foundries , wafers , Wafer dicing , chip carrier package, chip die ,http://portalrankings.com/info/mirrorsemi.com
Open Air Cavity QFN Package. Organic Open Cavity for MEMS, RF, Sensors and Semiconductors.
- Updated On (Date): 2017-Jan-24
- Expiration time: 2020-Apr-13
- Website Registered On (Date): 2006-Apr-13
The Woggie Projecthttp://portalrankings.com/info/standupcomedy.me
Woggie is movie about a man that travels to Los Angeles seeking fame but ends up in a dinosaur costume at the Hollywood Highland Mall offering photos to tourists for money.
- Google+ User ID: 114615695393793952825
- Updated On (Date): 2017-Oct-04
- Expiration time: 2018-Nov-21
- Website Registered On (Date): 2011-Nov-21
Index of /http://portalrankings.com/info/bdixmedia.com
- Updated On (Date): 2017-Mar-04
- Expiration time: 2018-Feb-22
- Website Registered On (Date): 2014-Feb-22
The 1212 Project - Instant Film Photography.http://portalrankings.com/info/the1212project.com
The 1212 Project, an art project dedicated to instant film photography, conceived by Penny Felts.
- Google Analytics code: 64079888-1
- Updated On (Date): 2017-May-14
- Expiration time: 2018-May-14
- Website Registered On (Date): 2013-May-14
Home - Project Yourselfhttp://portalrankings.com/info/projectyourself.com
- Known AddThis user account ID: ra-5481d6ef1113a7ea
- ID for Google Adsense: ca-pub-8879302071743746
- Google Analytics code: 40066324-1
- Updated On (Date): 2017-Mar-05
- Expiration time: 2017-Aug-28
- Website Registered On (Date): 2006-Aug-28