Websites targeting keyword flip chip bonder

ATCO manufactures precise equipment for soldering, assembly, and repair of printed circuit boards and microelectronics. Products include SMD and BGA Rework Stations, Flip Chip Bonder, SMT Reflow Ovens, Reflow Simulators, and semi automatic SMT pick and place machines. All systems are made in USA and include a comprehensive 5 years warranty.

Forum for Review of Microfabrication , semiconductor manufacturing Equipment and Process. View list of equipment manufactures and systems . Read or post reviews, discussions, videos, presentations in discussion board.

Supplier/Manufacturer of Flip Chip bonders, Die bonders, BGA / QFN / SMT rework stations, soldering equipment, smt rework and pick and place machines

High accuracy, modular die bonders for flip chip, assembly, packaging, and die attach. Advanced rework stations for BGAs, small passives, QFNs, package on package, and reballing.